TekNational - Tek-Sil® TSPG-15A

Tek-Sil® Gap Filler TSPG-15A

Tek-Sil® TSPG-15A is a highly thermally conductive and high viscosity silicone compound. It provides a thermal solution for the recent trends into smaller electronic devices. Tek-Sil® TSPG-15A easily forms and adheres to most surfaces, shapes, and sizes of components.

Property	Unit	TSPG-15A
Specific Gravity	-	2.8
Viscosity	Pa-s	2000
Flow Rate	cc/min	8
Thermal Conductivity	W/mK	1.5
Volume Resistivity	MO-m	1.0x10^6
Breakdown Voltage	kV/mm	10
Withstand Voltage	Kv/mm	8
Flame Retardancy	UL94	V-O equivalent
TGA Weight Loss	wt%	0.1
Operating Temp Range	°C	-40 to +150
Thermal Resistance	°Cin²/W	0.6 at 1.0mm gap
Compression Load/Modulus	N	Peak 19.6 /Sustain 1.0

	Gaps	Initial	100hrs	250hrs	500hrs	1000hrs
	1.0mm	0.6	0.6	0.6	0.6	0.6
+150°C Aging	2.0mm	1.1	1.1	1.2	1.2	1.2
	3.0mm	1.6	1.9	1.9	1.9	1.9
	1.0mm	0.6	0.6	0.6	0.6	0.6
-40°C aging	2.0mm	1.1	1.1	1.1	1.1	1.1
	3.0mm	1.6	1.6	1.6	1.6	1.6
	1.0mm	0.6	0.6	0.6	0.6	0.6
+60°C 95%RH Aging	2.0mm	1.1	1.1	1.2	1.2	1.2
	3.0mm	1.6	1.9	1.9	1.9	1.9
	1.0mm	0.6	0.6	0.6	0.6	0.6
-40°C to +125°C Heat Shock	2.0mm	1.1	1.2	1.3	1.3	1.3

Unit of thermal resistance: °Cin²/W based on ASTM D5470 Test Method

Contact surface: 3.14cm²(.49in²)

Filled material's weight: 0.5mm - .45g

Viscosity under heat, cold, humid and thermal shock conditions.

	Unit	Initial	1000 hrs later
+70°C Aging	Pa·s*	600	600
+120°C Aging	Pa·s*	600	800
+150°C Aging	Pa·s*	600	1700
-40°C Aging	Pa·s*	600	300
+60°C 95%RH Aging	Pa·s*	600	600
-40°C to +125°C Heat Shock	Pa·s*	600	800

*Accurate Rotary Viscometer (RV1)

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